ISPS 2021 – Proceedings

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ISPS’21

15th INTERNATIONAL SEMINAR ON POWER
SEMICONDUCTORS

CONTENTS OF PROCEEDINGS

ORGANISER: The IET Czech Network
Technická 2, 166 27 Praha 6
In cooperation with: Czech Technical University in Prague,
Faculty of Electrical Engineering, Department of Electrotechnology
IEEE Czechoslovakia Section
ORGANISING COMMITTEE:
Chairman: Prof. Vítězslav Benda, Ph.D., FIET
Members: Dr. Vítězslav Jeřábek, MIET
Dr. Martin Molhanec
Dr. Ladislava Černá, MIET
Dr. Pavel Hrzina
INTERNATIONAL PROGRAMME COMMITTEE:
Chairman:
Prof. Gerhard Wachutka, Technical University of Munich, GER
Co-chairman:
Prof. Nando Kaminski, University of Bremen, GER
Prof. Josef Lutz, Chemnitz University of Technology, GER
Prof. Ekkanath Madathil Sankara Narayanan, University of Sheffield, UK
Members:
Prof. Vítězslav Benda, Czech Technical University in Prague, CZ
Prof. Merlyne De Souza, University of Sheffield, UK
Prof. Daniel Donoval, Slovak Technical University, SK
Dr. David Flores, CNM-CSIC Barcelona, ES
Dr. David Green, Silvaco, UK
Dr. Reinhard Herzer, Semikron, GER
Prof. Andrea Irace, University of Naples, IT
Dr. Masayasu Ishiko, Toyota Central R&D Labs, JP
Dr. Akira Nakajima, AIST, JP
Prof. Andrzej Napieralski, Technical Univ. of Łódź, PL
Prof. Wai Tung Ng, University of Toronto, CA
Dr. Václav Papež, Czech Technical University in Prague, CZ
Dr. Sameer Pendharkar, Texas Instruments, USA
Dr. Munaf Rahimo, MTAL GmbH, CH
Dr. Jaume Roig, ON Semiconductor, BE
Dr. Wataru Saito, Kyushu University, JP
Dr. Hans-Joachim Schulze, Infineon, GER
Prof. John Shen, Illinois Institute of Technology, USA
Dr. Ralf Siemieniec, Infineon, AT
Dr. Ritu Sodhi, Empower Semiconductor, IND
Prof. Siegfried Selberherr, Tech. University of Vienna, AT
Prof. Jan Vobecký, Hitachi-ABB Power Grids, CH
Prof. Bo Zhang, UESTC, CHN
EDITOR: V. Benda and G. Wachutka
© České centrum IET 2021

ISBN 978-80-01-06875-5