Ph.D. student, Research assistant
Email: veselp13@fel.cvut.cz
Telephone: +420 2 2435 2349
Room: T2:G1-123
Education
- 2017 Czech Technical University in Prague, Faculty of Electrical Engineering, brunch of study Electrotechnology and Materials, doctoral study (assumed date of termination 2021)
- 2012-2017 Czech Technical University in Prague, Faculty of Electrical Engineering, study programme Electrical Engineering, Power Engineering and Management, brunch of study Technological Systems, terminated by Master degree state examination (June 2017), acquired title Ing.
Work experience
- since 2017 Research assistant, electron microscope operator, Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
- since 2017 Lector of leisure activities for kids with IT and Electronics specialization, Kroužky s.r.o.
Teaching
- Materials for Power Electrical Engineering (practise)
- Technology in Electrical Engineering (practise)
Research
- Soldering in electronics – materials, technologies, processes, reliability
- Diagnostics methods – microscopy, thermal analyses, mechanical testing
- Additive manufacturing in electronics – materials, technologies
Projects and funding
- 2019 Study of 3D printing materials properties, Student Grant Competion of CTU, Grant No. SGS19/062/OHK/1T/13 (Proposer)
- 2018 Study of properties of 3D printed objects, Student Grant Competition of CTU, Grant No. SGS18/072/OHK3/1T/13 (Proposer)
- 2017-2019 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS18/180/OHK3/3T/13 (Researcher)
- 2015-2017 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS15/196/OHK3/3T/13 (Researcher)
Publications
- Veselý, E. Horynová, J. Starý, D. Bušek, K. Dušek, V. Zahradník, M. Plaček, P. Mach, M. Kučírek, V. Ježek, M. Dosedla, (2018) “Solder joint quality evaluation based on heating factor”, Circuit World, Vol. 44 Issue: 1, pp.37-44, https://doi.org/10.1108/CW-10-2017-0059
- Veselý, T. Tichý, O. Šefl, E. Horynová, (2018) “Evaluation of dielectric properties of 3D printed objects based on printing resolution”, IOP Conference Series: Materials Science and Engineering, Vol. 461 Issue: 1, https://doi.org/10.1088/1757-899X/461/1/012091
- Dušek, P. Veselý, M. Šimek, A. Rudajevová, (2016) “Experimental study of the influence of the temperature profile on the BGA soldering”, 2016 39th International Spring Seminar on Electronics Technology (ISSE), https://doi.org/10.1109/ISSE.2016.7563190
Za informace zodpovídá/Responsible for the information: Petr Veselý