Ing. Petr Veselý, Ph.D.

Assistant Professor

Email: veselp13@fel.cvut.cz
Telephone: +420 2 2435 2349
Room: T2:G1-123

Research topics

  • Additive manufacturing in electronics – development of novel materials based on polymer composites, manufacturing technologies
  • Soldering and assembly in electronics – materials, technologies, processes, reliability
  • Diagnostic methods – microscopy, thermal analyses, mechanical testing

Research groups

  • 3DP Lab (research group leader)
  • Material Diagnostics&Electronic Assembly Reliability (member)

Doctoral students

  • Ing. Iva Králová
  • Ing. Markéta Klimtová
  • Ing. Daniel Koc

Education

  • 2017-2022 Czech Technical University in Prague, Faculty of Electrical Engineering, brunch of study Electrotechnology and Materials, doctoral study terminated by dissertation thesis defense (April 2022), acquired title Ph.D.
  • 2012-2017 Czech Technical University in Prague, Faculty of Electrical Engineering, study program Electrical Engineering, Power Engineering and Management, brunch of study Technological Systems, terminated by Master degree state examination (June 2017), acquired title Ing.

Work experience

  • since 2023 Assistant Professor – Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
  • 2017-2023 Researcher, laboratory technician, electron microscope operator – Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
  • 2017-2020 Lector of leisure activities for kids with IT and Electronics specialization – Kroužky s.r.o.

Teaching

  • Materials for Power Electrical Engineering (practice)
  • Electrical Engineering Technological Processes (practice and lectures)
  • Ecology and Materials (practice)
  • supervisor of semestral/bachelor/diploma projects

Projects and funding

  • 2024-2026 Sustainable Electronics Assembly Utilizing Plastic Waste (SELECT), Technology Agency of the Czech Republic, 7th public competition of Environment for Life programme, project no. SS07020107 (main proposer)
  • 2024-2026 3D Printing in Electronics: Advanced Materials and Structures, Grant No. SGS24/137/OHK3/3T/13 (proposer)
  • 2024 Innovation of laboratory exercises in the course Technological Processes for Electrical Engineering, Development projekct of academic staff and students (RPAPS) 2024, Czech Technical University in Prague (proposer)
  • 2020-2023 Electrochemical system for recycling industrial copper cable waste (ERIC), Technology Agency of the Czech Republic, Grant No. SS01020524 (researcher)
  • 2021-2022 Výzkum vlivu použitých komponent na LED čip v rámci vývoje nového LED modulu, který je určen pro náročné aplikace v chemickém průmyslu, Ministry of Industry and Trade, Czech Republic, Grant No. CZ.01.1.02/0.0/0.0/20_321/0023609 (researcher)
  • 2021 Application Possibilities of 3D Printing in Electrical Engineering, Student Grant Competition of CTU, Grant No. SGS21/060/OHK3/1T/13 (proposer)
  • 2020 Additive Manufacturing in Electrical Engineering, Student Grant Competition of CTU, Grant No. SGS20/060/OHK3/1T/13 (proposer)
  • 2019 Study of 3D printing materials properties, Student Grant Competition of CTU, Grant No. SGS19/062/OHK3/1T/13 (proposer)
  • 2018-2019 InovaFOND – Paste Hand Dispenser, Technology Agency of the Czech Republic, Grant No. TG02010033 (researcher)
  • 2018 Study of properties of 3D printed objects, Student Grant Competition of CTU, Grant No. SGS18/072/OHK3/1T/13 (proposer)
  • 2018-2020 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS18/180/OHK3/3T/13 (researcher)
  • 2015-2017 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS15/196/OHK3/3T/13 (researcher)

Selected publications

  • Dušek, K.; Koc, D.; Veselý, P.; Froš, D.; Géczy, A. Biodegradable Substrates for Rigid and Flexible Circuit Boards: A Review. Advanced Sustainable Systems. 2025, 9(1), ISSN 2366-7486.
  • Veselý, P.; Králová, I.; Pilnaj, D.; Plaček, M.; Dušek, K. SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux. Advanced Engineering Materials. 2024, 26(23), ISSN 1438-1656.
  • Králová, I.; Pilnaj, D.; Georgievski, O.-P.; Uřičář, J.; Veselý, P.; Klimtová, M.; Dušek, K. Wettability in lead-free soldering: Effect of plasma treatment in dependence on flux type. Applied Surface Science. 2024, 668 1-9. ISSN 0169-4332.
  • Veselý, P.; Froš, D.; Hudec, T.; Sedláček, J.; Ctibor, P.; Dušek, K.: Dielectric spectroscopy of PETG/TiO2 composite intended for 3D printing, Virtual and Physical Prototyping. 2023, 18(1), ISSN 1745-2759.
  • Veselý, P.; Zdráhal, J.; Králová, I.; Klimtová, M.; Froš, D. Solderless Component Assembly: Novel Ecological Approach to Electronics Production. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2023. ISSN 2161-2536. ISBN 979-8-3503-3484-5.
  • Veselý, P.; Froš, D.; Klimtová, M.; Gharaibeh, A.; Medgyes, B. Effect of Incorporation of Ceramic Nanoparticles in Bismuth-Tin Solder Paste on Electrochemical Migration. In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2023. ISSN 2161-2536. ISBN 979-8-3503-3484-5.
  • Veselý, P.; Dušek, K.; Froš, D.: Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design, Journal of Manufacturing Processes. 2022, 81 696-706. ISSN 1526-6125.
  • Froš, D.; Veselý, P.; Zemen, J.; Dušek, K.: Latent heat induced deformation of PCB substrate: Measurement and simulation, Case Studies in Thermal Engineering. 2022, 36 ISSN 2214-157X.
  • Veselý, P.; Klimtová, M.; Froš, D.: Electrochemical Migration Issues Related to Improper Solder Mask Application, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2022.  ISSN 2161-2528. ISBN 978-1-6654-6590-8.
  • Dušek, K.; Bušek, D.; Veselý, P.; Plaček, M.; Reichl, T.; Sedláček, J.; Mach, P.: Analysis of a failure in a molded package caused by electrochemical migration, Engineering Failure Analysis. 2021, 121 1-8. ISSN 1350-6307.
  • Veselý, P.; Bušek, D.; Krammer, O.; Dušek, K.: Analysis of no-clean flux spatter during the soldering process, Journal of Materials Processing Technology. 2020, 275 ISSN 0924-0136
  • Veselý, P. et al.: Solder joint quality evaluation based on heating factor, Circuit World. 2018, 44(1), 37-44. ISSN 0305-6120.
  • Veselý, P.; Tichý, T.; Šefl, O.; Horynová, E.: Evaluation of dielectric properties of 3D printed objects based on printing resolution, IOP Conference Series: Materials Science and Engineering. 2018, 461(1), ISSN 1757-899X.

Applied research results

  • Vojtěch, L.; Dušek, K.; Neruda, M.; Bartošová, K.; Veselý, P.; Vigner, V. Zařízení pro elektrolytickou výrobu měděných fólií. Czechia. Patent CZ 310165. 2024-09-05.
  • Vojtěch, L.; Dušek, K.; Neruda, M.; Bartošová, K.; Veselý, P.; Vigner, V. Střešní nebo fasádní krytina. Czechia. Utility Model CZ 37309. 2023-09-18.
  • Bortel, R.; Dušek, K.; Hospodka, J.; Bušek, D.; Veselý, P. Ruční dávkovač pastovitých látek. Czechia. Patent CZ 308725. 2021-02-17.