Ing. Petr Veselý

Ph.D. student, Research assistant

Email: veselp13@fel.cvut.cz
Telephone: +420 2 2435 2349
Room: T2:G1-123

Education

  • 2017 Czech Technical University in Prague, Faculty of Electrical Engineering, brunch of study Electrotechnology and Materials, doctoral study (assumed date of termination 2021)
  • 2012-2017 Czech Technical University in Prague, Faculty of Electrical Engineering, study program Electrical Engineering, Power Engineering and Management, brunch of study Technological Systems, terminated by Master degree state examination (June 2017), acquired title Ing.

Work experience

  • since 2017 Research assistant, electron microscope operator, Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
  • 2017-2020 Lector of leisure activities for kids with IT and Electronics specialization, Kroužky s.r.o.

Teaching

  • Materials for Power Electrical Engineering (practise)
  • Electrical engineering technological processes (practise)
  • Ecology and materials (practice)

Research topics

  • Soldering in electronics – materials, technologies, processes, reliability
  • Diagnostics methods – microscopy, thermal analyses, mechanical testing
  • Additive manufacturing in electronics – materials, technologies

Projects and funding

  • 2020 Additive Manufacturing in Electrical Engineering, Student Grant Competition of CTU, Grant No. SGS20/060/OHK3/1T/13 (Proposer)
  • 2019 Study of 3D printing materials properties, Student Grant Competition of CTU, Grant No. SGS19/062/OHK3/1T/13 (Proposer)
  • 2018-2019 InovaFOND – Paste Hand Dispenser , Technology Agency of the Czech Republic, Grant No. TG02010033 (Researcher)
  • 2018 Study of properties of 3D printed objects, Student Grant Competition of CTU, Grant No. SGS18/072/OHK3/1T/13 (Proposer)
  • 2018-2020 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS18/180/OHK3/3T/13 (Researcher)
  • 2015-2017 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS15/196/OHK3/3T/13 (Researcher)

 

Publications

  • Veselý, P.; Bušek, D.; Krammer, O.; Dušek, K.: Analysis of no-clean flux spatter during the soldering proces, Journal of Materials Processing Technology. 2020, 275 ISSN 0924-0136
  • Veselý, P.; Kozák, M.: Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2020. International Spring Seminar on Electronics Technology (ISSE). ISSN 2161-2528. ISBN 978-1-7281-6774-9
  • Veselý, P.; Minář, J.; Pražanová, A.; Šefl, O.; Dušek, K.: Novel Electrical Insulation Materials – Mechanical Performance of 3D Printed Polylactic Acid, In: 2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Institute of Electrical and Electronics Engineers, Inc., 2020. ISBN 978-1-7281-5879-2
  • Veselý, P.; Dušek, K.; Staňková, A.: Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor, In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2019. International Spring Seminar on Electronics Technology ISSE. ISSN 2161-2528. ISBN 978-1-7281-1875-8
  • Veselý, P.; Horynová, E.; Starý, J.; Bušek, D.; Dušek, K.; Zahradník, V.; Plaček, M.; Mach, P. et al.: Solder joint quality evaluation based on heating factor, Circuit World. 2018, 44(1), 37-44. ISSN 0305-6120
  • Veselý, P.; Tichý, T.; Šefl, O.; Horynová, E.: Evaluation of dielectric properties of 3D printed objects based on printing resolution, IOP Conference Series: Materials Science and Engineering. 2018, 461(1), ISSN 1757-899X