Ing. Petr Veselý, Ph.D.

research scientist

Email: veselp13@fel.cvut.cz
Telephone: +420 2 2435 2349
Room: T2:G1-123

Education

  • 2017-2022 Czech Technical University in Prague, Faculty of Electrical Engineering, brunch of study Electrotechnology and Materials, doctoral study terminated by dissertation thesis defense (April 2022), acquired title Ph.D.
  • 2012-2017 Czech Technical University in Prague, Faculty of Electrical Engineering, study program Electrical Engineering, Power Engineering and Management, brunch of study Technological Systems, terminated by Master degree state examination (June 2017), acquired title Ing.

Work experience

  • since 2017 Research assistant, electron microscope operator, Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology
  • 2017-2020 Lector of leisure activities for kids with IT and Electronics specialization, Kroužky s.r.o.

Teaching

  • Materials for Power Electrical Engineering (practice)
  • Electrical engineering technological processes (practice)
  • Ecology and materials (practice)

Research topics

  • Soldering in electronics – materials, technologies, processes, reliability
  • Diagnostics methods – microscopy, thermal analyses, mechanical testing
  • Additive manufacturing in electronics – materials, technologies

Research groups

  • 3DP Lab (head of research group)
  • Material Diagnostics&Electronic Assembly Reliability (researcher)

Projects and funding

  • 2020-2023 Electrochemical system for recycling industrial copper cable waste (ERIC), Technology Agency of the Czech Republic, Grant No. SS01020524 (researcher)
  • 2021-2022 Výzkum vlivu použitých komponent na LED čip v rámci vývoje nového LED modulu, který je určen pro náročné aplikace v chemickém průmyslu, Ministry of Industry and Trade, Czech Republic, Grant No. CZ.01.1.02/0.0/0.0/20_321/0023609 (researcher)
  • 2021 Application Possibilities of 3D Printing in Electrical Engineering, Student Grant Competition of CTU, Grant No. SGS21/060/OHK3/1T/13 (proposer)
  • 2020 Additive Manufacturing in Electrical Engineering, Student Grant Competition of CTU, Grant No. SGS20/060/OHK3/1T/13 (proposer)
  • 2019 Study of 3D printing materials properties, Student Grant Competition of CTU, Grant No. SGS19/062/OHK3/1T/13 (proposer)
  • 2018-2019 InovaFOND – Paste Hand Dispenser, Technology Agency of the Czech Republic, Grant No. TG02010033 (researcher)
  • 2018 Study of properties of 3D printed objects, Student Grant Competition of CTU, Grant No. SGS18/072/OHK3/1T/13 (proposer)
  • 2018-2020 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS18/180/OHK3/3T/13 (researcher)
  • 2015-2017 Solder joints reliability, Student Grant Competition of CTU, Grant No. SGS15/196/OHK3/3T/13 (researcher)

Publications

  • Veselý, P.; Dušek, K.; Froš, D.: Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design, Journal of Manufacturing Processes. 2022, 81 696-706. ISSN 1526-6125.
  • Froš, D.; Veselý, P.; Zemen, J.; Dušek, K.: Latent heat induced deformation of PCB substrate: Measurement and simulation, Case Studies in Thermal Engineering. 2022, 36 ISSN 2214-157X.
  • Dušek, K.; Bušek, D.; Veselý, P.; Pražanová, A.; Plaček, M.; Re, J.D.: Understanding the Effect of Reflow Profile on the Metallurgical Properties of Tin–Bismuth Solders, Metals — Open Access Metallurgy Journal. 2022, 12(1), ISSN 2075-4701
  • Veselý, P.; Klimtová, M.; Froš, D.: Electrochemical Migration Issues Related to Improper Solder Mask Application, In: 2022 45th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2022.  ISSN 2161-2528. ISBN 978-1-6654-6590-8.
  • Tichý, T.; Šefl, O.; Veselý, P.; Dušek, K.; Bušek, D.: Mathematical Modelling of Temperature Distribution in Selected Parts of FFF Printer during 3D Printing Process, Polymers. 2021, 13(23), ISSN 2073-4360.
  • Froš, D.; Dušek, K.; Veselý, P.: Investigation of Impacts on Printed Circuit Board Laminated Composites Caused by Surface Finish Application, Polymers. 2021, 13(19), ISSN 2073-4360.
  • Dušek, K.; Bušek, D.; Veselý, P.; Plaček, M.; Reichl, T.; Sedláček, J.; Mach, P.: Analysis of a failure in a molded package caused by electrochemical migration, Engineering Failure Analysis. 2021, 121 1-8. ISSN 1350-6307.
  • Veselý, P.; Froš, D.: Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions, In: 2021 44th International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2021. p. 1-7. ISSN 2161-2528. ISBN 978-1-6654-1477-7.
  • Veselý, P.; Bušek, D.; Krammer, O.; Dušek, K.: Analysis of no-clean flux spatter during the soldering process, Journal of Materials Processing Technology. 2020, 275 ISSN 0924-0136
  • Veselý, P.; Kozák, M.: Accelerated Aging of Bismuth-Tin Solder Joints on Various Substrates, In: 2020 43rd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2020. ISSN 2161-2528. ISBN 978-1-7281-6774-9
  • Veselý, P.; Minář, J.; Pražanová, A.; Šefl, O.; Dušek, K.: Novel Electrical Insulation Materials – Mechanical Performance of 3D Printed Polylactic Acid, In: 2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika). Institute of Electrical and Electronics Engineers, Inc., 2020. ISBN 978-1-7281-5879-2
  • Veselý, P.; Dušek, K.; Staňková, A.: Evaluation of Bismuth/Tin Solder Intermetallic Layers Based on Heating Factor, In: 2019 42nd International Spring Seminar on Electronics Technology (ISSE). New York: IEEE Press, 2019. ISSN 2161-2528. ISBN 978-1-7281-1875-8
  • Veselý, P.; Horynová, E.; Starý, J.; Bušek, D.; Dušek, K.; Zahradník, V.; Plaček, M.; Mach, P. et al.: Solder joint quality evaluation based on heating factor, Circuit World. 2018, 44(1), 37-44. ISSN 0305-6120
  • Veselý, P.; Tichý, T.; Šefl, O.; Horynová, E.: Evaluation of dielectric properties of 3D printed objects based on printing resolution, IOP Conference Series: Materials Science and Engineering. 2018, 461(1), ISSN 1757-899X